Our Committees

Members of Steering Committee 2023 (By ABC): 

Avi Baum, CTO, Hailo Technologies 

Dorit Medina, Chip Design & Verification Academic, Masterschool

Eran Rotem, VP R&D, RAAAM Memory Technologies

Ido Bukspan, CEO, Pliops

Ilan Hochman, Israel Sales Manager, Altera

Moran Amidan, Senior VLSI designer, Sony

Nadav Ben Ezer, Managing Director, Avnet ASIC Israel

Prof. Ran Ginosar, Head, VLSI Systems Research Center, Technion, President, Ramon Space

Racheli Ganot, Founder and CEO,Ready Group

Dr. Rakefet Kol, Architecture Manager, Intel

Shmuel Auster, Chair, IEEE Israel Section & Chair, Israeli Society of Electronics Engineers

Mr. Shlomo Gradman, CEO ASG, Co-Chairman, ChipEx2024, Head of Committee

Yigal Ben Eliyahu, Area Director Israel at Siemens EDA

Yonathan Wand, Managing Director, Magic Wand

Yossi Benizri, Founder & CEO, Beyond Electronics

Yuri Miroshnik, Director, IC Design Engineering, Broadcom


Members of TPC Member Committee 2023 (By ABC): 

 

 

Prof. Adam Teman, Bar Ilan University

Dr. Arkadiy Morgenshtein, VLSI Leader, TriEye

Boaz Ben-Nun, Director of VLSI, Arbe

Dror Avni, Industry Expert

Prof. Ephi Zehavi, Bar Ilan University

Dr. Matan Gal-Katziri, Ben-Gurion University

Dr. Rakefet Kol, Architect Manager, Intel

Dr. Reuven Dobkin, CEO, Vsync, Vice Chairman of TPC

Prof. Ran Ginosar, Head, VLSI Systems Research Center, Technion, Chairman of TPC

Prof. Yoseph Bernstein, Ariel University

Prof. Yossi Shacham, Head of the Scojen Institute for Synthetic, Reichman University

Tzach Hadas, COO at PLSense

Tzach Hadas, COO, PLSense

 

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